Dates: January 14 [Wed] - 16 [Fri], 2015
Venue: Tokyo Big Sight, Tokyo, JAPAN
Organised by: Reed Exhibitions Japan Ltd.
Exhibition Title: 16th IC PACKAGING TECHNOLOGY EXPO
Concurrent Event:
IC PACKAGING TECHNOLOGY EXPO Technical Conference
Special Exhibit Zones:
Semiconductor Device Inspection & Testing Zone
SATS/Contract Design Services Zone
Plating/Etching Zone
MEMS Packaging Zone
Concurrent Shows held inside NEPCON JAPAN 2015 – 44th Electronics R&D and Manufacturing Technology Expo
44th INTERNEPCON JAPAN
32nd ELECTROTEST JAPAN
16th ELECTRONIC COMPONENTS & MATERIALS EXPO
PWB EXPO–16th Printed Wiring Boards Expo
5th FINE PROCESS TECHNOLOGY EXPO
Concurrent Shows of NEPCON JAPAN 2015 – 44th Electronics R&D and Manufacturing Technology Expo
[NEW]1st WEARABLE EXPO - Wearable Device Technology Expo
AUTOMOTIVE WORLD 2015
LIGHTING JAPAN 2015
Visitor Profile
Professionals of semiconductor assembly & electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
Visitors are from:
Semiconductor Manufacturers
Assembly Manufacturers/SATS
Sensor Manufacturers
Set Manufacturers (in high-density SMT)
MEMS Devices/LED Manufacturers
Automotive Electronics Manufacturers
Exhibit Profile
Assembly Equipment
Wire Bonders
Die Bonders
FC Bonders
Other Various Bonders
Molding Machines
Resin Coating Machines
Dicing Machines
Lead Processing Machines
Laser Processors
Other Equipment for IC Packaging
Packaging Materials/Components
Sealant (Mold Materials)/Under-fill Materials
ACF/NCF, ACP/NCP
Die Adhesives
Lead Frames
Bonding Wires
Tape Materials
Soldering Balls/Materials
Bump Materials
Packaging Substrates
(PCBs, Tape Substrates, Ceramic Substrates, etc.)
Other Materials/Components
Analysis/Simulation Software for IC Packaging
Analysis Services/Software
Simulation Software
Various Software, etc.
Various Packages
CSP
BGA
Wafer Level CSP
MCM, etc.
Semiconductor Device Inspection & Testing Zone
Specialised in Inspection Equipment/Testers/Measurement for Semiconductor Device!
Memory Testers
SoC Testers
IC Test Sockets
IC Test Clips
Inspection Connectors
Burn-in Inspection Equipment
(Reliability Test, Thermal Resistance Test)
IC Vision Inspection System
Bump Vision Inspection System
X-ray Inspection Equipment
Circuit Modification System/Software
Defect Analysis System/Software
Measurement Equipment
Test Services
Analysis Services
Handlers
Probe Cards
Probes etc.
SATS/Contract Design Services Zone
Gathering World's TOP companies specialised in IC design, assembly and testing services!
Semiconductor
LED Packaging Solutions
Sensor Module Assembly
Mounting, Packaging Solutions
MEMS Device Packaging Solutions
Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
Plating/Etching Zone
Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.
Plating Materials/Chemicals/Equipment
Plating Process
Etching Chemicals/Equipment
Etching Process
Inspection Equipment
Surface Processing Technology/Related Products, etc.
MEMS Packging Zone
3D Integration, 3D Packaging Technologies for MEMS Devices Gather!
[MEMS Device Manufacturing Equipment］
Dicing Machines
Die Bonders
Wire Bonders
Flipchip Bonders
Microchip Bonders etc.
[Molding Machines］
Welding Machines
Fine Processing Equipment
Drilling Machines
Plating Equipment
Coating Machines
Sputtering System
Exposure Equipment
Vacuum Equipment
Bonding Equipment
Heat Press Machines
Imprinting Systems
Coaters, Developers
Spray Coaters
Embossing Systems
Laser Beam Writers
Etching Equipment
Cleaning Systems
Drying Systems
Conveying Equipment etc.
[Evaluation/Measurement/Testing Equipment］
Measurement Equipment
Evaluation Equipment
Analysis Equipment
Microscopes (Laser Microscopes, Electron Microscopes, Transmission Electron Microscopes, etc.)
Analysis Systems
Vision Inspection Equipment
X-ray Inspection Equipment etc.
[MEMS Packaging Materials］
Substrates
Lead Frames
Glass Substrates
Silicon Wafers
SB Wafers
Soldering Balls
Bump Materials
Adhesives
Taping Materials
Sealants
Bonding Wires
Plating Materials, Chemicals
Chemicals
Etching Materials
Nano-imprint Materials
Resist Materials
Adhesives
Protective Materials etc.
Contact Details
Contact Person:Hajime Suzuki (Mr.), Taikoku K
Telephone:
Venue: Tokyo Big Sight, Tokyo, JAPAN
Organised by: Reed Exhibitions Japan Ltd.
Exhibition Title: 16th IC PACKAGING TECHNOLOGY EXPO
Concurrent Event:
IC PACKAGING TECHNOLOGY EXPO Technical Conference
Special Exhibit Zones:
Semiconductor Device Inspection & Testing Zone
SATS/Contract Design Services Zone
Plating/Etching Zone
MEMS Packaging Zone
Concurrent Shows held inside NEPCON JAPAN 2015 – 44th Electronics R&D and Manufacturing Technology Expo
44th INTERNEPCON JAPAN
32nd ELECTROTEST JAPAN
16th ELECTRONIC COMPONENTS & MATERIALS EXPO
PWB EXPO–16th Printed Wiring Boards Expo
5th FINE PROCESS TECHNOLOGY EXPO
Concurrent Shows of NEPCON JAPAN 2015 – 44th Electronics R&D and Manufacturing Technology Expo
[NEW]1st WEARABLE EXPO - Wearable Device Technology Expo
AUTOMOTIVE WORLD 2015
LIGHTING JAPAN 2015
Visitor Profile
Professionals of semiconductor assembly & electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
Visitors are from:
Semiconductor Manufacturers
Assembly Manufacturers/SATS
Sensor Manufacturers
Set Manufacturers (in high-density SMT)
MEMS Devices/LED Manufacturers
Automotive Electronics Manufacturers
Exhibit Profile
Assembly Equipment
Wire Bonders
Die Bonders
FC Bonders
Other Various Bonders
Molding Machines
Resin Coating Machines
Dicing Machines
Lead Processing Machines
Laser Processors
Other Equipment for IC Packaging
Packaging Materials/Components
Sealant (Mold Materials)/Under-fill Materials
ACF/NCF, ACP/NCP
Die Adhesives
Lead Frames
Bonding Wires
Tape Materials
Soldering Balls/Materials
Bump Materials
Packaging Substrates
(PCBs, Tape Substrates, Ceramic Substrates, etc.)
Other Materials/Components
Analysis/Simulation Software for IC Packaging
Analysis Services/Software
Simulation Software
Various Software, etc.
Various Packages
CSP
BGA
Wafer Level CSP
MCM, etc.
Semiconductor Device Inspection & Testing Zone
Specialised in Inspection Equipment/Testers/Measurement for Semiconductor Device!
Memory Testers
SoC Testers
IC Test Sockets
IC Test Clips
Inspection Connectors
Burn-in Inspection Equipment
(Reliability Test, Thermal Resistance Test)
IC Vision Inspection System
Bump Vision Inspection System
X-ray Inspection Equipment
Circuit Modification System/Software
Defect Analysis System/Software
Measurement Equipment
Test Services
Analysis Services
Handlers
Probe Cards
Probes etc.
SATS/Contract Design Services Zone
Gathering World's TOP companies specialised in IC design, assembly and testing services!
Semiconductor
LED Packaging Solutions
Sensor Module Assembly
Mounting, Packaging Solutions
MEMS Device Packaging Solutions
Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
Plating/Etching Zone
Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.
Plating Materials/Chemicals/Equipment
Plating Process
Etching Chemicals/Equipment
Etching Process
Inspection Equipment
Surface Processing Technology/Related Products, etc.
MEMS Packging Zone
3D Integration, 3D Packaging Technologies for MEMS Devices Gather!
[MEMS Device Manufacturing Equipment］
Dicing Machines
Die Bonders
Wire Bonders
Flipchip Bonders
Microchip Bonders etc.
[Molding Machines］
Welding Machines
Fine Processing Equipment
Drilling Machines
Plating Equipment
Coating Machines
Sputtering System
Exposure Equipment
Vacuum Equipment
Bonding Equipment
Heat Press Machines
Imprinting Systems
Coaters, Developers
Spray Coaters
Embossing Systems
Laser Beam Writers
Etching Equipment
Cleaning Systems
Drying Systems
Conveying Equipment etc.
[Evaluation/Measurement/Testing Equipment］
Measurement Equipment
Evaluation Equipment
Analysis Equipment
Microscopes (Laser Microscopes, Electron Microscopes, Transmission Electron Microscopes, etc.)
Analysis Systems
Vision Inspection Equipment
X-ray Inspection Equipment etc.
[MEMS Packaging Materials］
Substrates
Lead Frames
Glass Substrates
Silicon Wafers
SB Wafers
Soldering Balls
Bump Materials
Adhesives
Taping Materials
Sealants
Bonding Wires
Plating Materials, Chemicals
Chemicals
Etching Materials
Nano-imprint Materials
Resist Materials
Adhesives
Protective Materials etc.
Contact Details
Contact Person:Hajime Suzuki (Mr.), Taikoku K
Telephone:
