What is ICP?
Gathers wide variety of Packaging Technologies for IC Devices!
All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.
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Visitor Profile
Professionals of semiconductor assembly & electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
Visitors are from:- Semiconductor Manufacturers
- Assembly Manufacturers/SATS
- Sensor Manufacturers
- Set Manufacturers (in high-density SMT)
- MEMS Devices/LED Manufacturers
- Automotive Electronics Manufacturers
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Exhibit Profile
Assembly Equipment
- Wire Bonders
- Die Bonders
- FC Bonders
- Other Various Bonders
- Molding Machines
- Resin Coating Machines
- Dicing Machines
- Lead Processing Machines
- Laser Processors
- Other Equipment for IC Packaging
Packaging Materials/Components
- Sealant (Mold Materials)/Under-fill Materials
- ACF/NCF, ACP/NCP
- Die Adhesives
- Lead Frames
- Bonding Wires
- Tape Materials
- Soldering Balls/Materials
- Bump Materials
- Packaging Substrates (PCBs, Tape Substrates, Ceramic Substrates, etc.)
- Other Materials/Components
Analysis/Simulation Software for IC Packaging
- Analysis Services/Software
- Simulation Software
- Various Software, etc.
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Various Packages
- CSP
- BGA
- Wafer Level CSP
- MCM, etc.
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Semiconductor Device Inspection & Testing Zone
Specialised in Inspection Equipment/Testers/Measurement for Semiconductor Device!
- Memory Testers
- SoC Testers
- IC Test Sockets
- IC Test Clips
- Inspection Connectors
- Burn-in Inspection Equipment
- (Reliability Test, Thermal Resistance Test)
- IC Vision Inspection System
- Bump Vision Inspection System
- X-ray Inspection Equipment
- Circuit Modification System/Software
- Defect Analysis System/Software
- Measurement Equipment
- Test Services
- Analysis Services
- Handlers
- Probe Cards
- Probes etc.
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SATS/Contract Design Services Zone
Gathering World's TOP companies specialised in IC design, assembly and testing services!
- Semiconductor
- LED Packaging Solutions
- Sensor Module Assembly
- Mounting, Packaging Solutions
- MEMS Device Packaging Solutions
- Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
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Plating/Etching Zone
Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.
- Plating Materials/Chemicals/Equipment
- Plating Process
- Etching Chemicals/Equipment
- Etching Process
- Inspection Equipment
- Surface Processing Technology/Related Products, etc.
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MEMS Packging Zone
3D Integration, 3D Packaging Technologies for MEMS Devices Gather!
[MEMS Device Manufacturing Equipment］
- Dicing Machines
- Die Bonders
- Wire Bonders
- Flipchip Bonders
- Microchip Bonders etc.
[Molding Machines］
- Welding Machines
- Fine Processing Equipment
- Drilling Machines
- Plating Equipment
- Coating Machines
- Sputtering System
- Exposure Equipment
- Vacuum Equipment
- Bonding Equipment
- Heat Press Machines
- Imprinting Systems
- Coaters, Developers
- Spray Coaters
- Embossing Systems
- Laser Beam Writers
- Etching Equipment
- Cleaning Systems
- Drying Systems
- Conveying Equipment etc.
[Evaluation/Measurement/Testing Equipment］
- Measurement Equipment
- Evaluation Equipment
- Analysis Equipment
- Microscopes (Laser Microscopes, Electron Microscopes, Transmission Electron Microscopes, etc.)
- Analysis Systems
- Vision Inspection Equipment
- X-ray Inspection Equipment etc.
[MEMS Packaging Materials］
- Substrates
- Lead Frames
- Glass Substrates
- Silicon Wafers
- SB Wafers
- Soldering Balls
- Bump Materials
- Adhesives
- Taping Materials
- Sealants
- Bonding Wires
- Plating Materials, Chemicals
- Chemicals
- Etching Materials
- Nano-imprint Materials
- Resist Materials
- Adhesives
- Protective Materials etc.
[MEMS Foundry Services (Contract Design, Prototype, Manufacturing)］
[Design Tools, Analysis and Simulation Software］
[Other Various MEMS Packaging Technologies］
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Contact Details
Contact Person:Hajime Suzuki (Mr.)
Telephone:
Fax:
Email:
